Image Sensors and Photodetectors Based on Low‐Carbon Footprint Solution‐Processed Semiconductors
Abstract This mini‐review explores the evolution of image sensors, essential electronic components increasingly integrated into daily life. Traditional manufacturing methods for image sensors and photodetectors, employing high carbon footprint techniques like thermal evaporation and chemical vapor deposition, are being replaced by environmentally conscious solution processing. Organic and Colloidal Quantum Dot‐based image sensors emerge as promising candidates, aligning with the shift toward solution‐based device integration. This review provides insights into the working principles of photodetectors and image sensors, summarizing relevant materials and fabrication approaches. Additionally, it delves into the detailed exploration of pixelated patterning techniques and their potential applications in the realm of solution‐processed image sensor fabrication.
Authors
- Renjun Liu (ORCID: https://orcid.org/0000-0001-5671-860X)
- William Solari
- Serena Nur Erkızan (ORCID: https://orcid.org/0000-0001-5251-9232)
- Bo Hou (ORCID: https://orcid.org/0000-0001-9918-8223)
- Peter M. Smowton (ORCID: https://orcid.org/0000-0002-9105-4842)
- Alexander R. C. Osypiw
Institutions
- Cardiff University (GB)
Publication Details
- Journal
- Advanced Sensor Research
- Published
- 2024-09-14
- DOI
- https://doi.org/10.1002/adsr.202400059
- Citations
- 2
- Primary Topic
- CCD and CMOS Imaging Sensors
- Type
- article
- Field-Weighted Citation Impact
- 0.42
Funders
- Leverhulme Trust
- Engineering and Physical Sciences Research Council