Enhanced High-Temperature Thermoelectric Performance in Te-Doped Electronegative Element-Filled Skutterudites via Suppressing Bipolar Effects and Enhanced Phonon Scattering

CoSb<sub>3</sub>-based skutterudites have great potential as midtemperature thermoelectric (TE) materials due to their low cost and excellent electrical and mechanical properties. Their application, however, is limited by the high thermal conductivity and the degradation of TE performance at elevated temperatures, attributed to the adverse effects of bipolar diffusion. Herein, a series of Se<sub><i>y</i></sub>Co<sub>4</sub>Sb<sub>12-<i>x</i></sub>Te<sub><i>x</i></sub> compounds were successfully synthesized by combining a solid-state reaction and spark plasma sintering techniques to mitigate these challenges. It was found that doping Te at the Sb sites effectively enhanced the carrier concentration and suppressed the bipolar effect to obtain a superior power factor of ∼43 μW cm<sup>-1</sup> K<sup>-2</sup>. Furthermore, due to the low resonant frequency of Se, filling voids of CoSb<sub>3</sub> with Se achieved a low lattice thermal conductivity of 1.55 W m<sup>-1</sup> K<sup>-1</sup>. Nevertheless, Se filling introduced additional holes, reducing the carrier concentration without a significant detriment of the carrier mobility. As a result, a maximum figure of merit of 1.23 was achieved for Se<sub>0.1</sub>Co<sub>4</sub>Sb<sub>11.55</sub>Te<sub>0.45</sub> at 773 K. This work provides a valuable guidance for selecting appropriate filling and doping components to achieve synergistic optimization of the acoustics and electronics of CoSb<sub>3</sub>-based skutterudites.

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Publication Details

Journal
ACS Applied Materials & Interfaces
Published
2024-09-13
DOI
https://doi.org/10.1021/acsami.4c11635
Citations
2
Primary Topic
Advanced Thermoelectric Materials and Devices
Type
article
Field-Weighted Citation Impact
0.23

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article

Enhanced High-Temperature Thermoelectric Performance in Te-Doped Electronegative Element-Filled Skutterudites via Suppressing Bipolar Effects and Enhanced Phonon Scattering

Wenwei Yang, Minhui Yuan, Zhanpeng Zhao, Zijie Ren et al.
2 citations
ACS Applied Materials & Interfaces
Advanced Thermoelectric Materials and Devices
0.23
article

Enhanced High-Temperature Thermoelectric Performance in Te-Doped Electronegative Element-Filled Skutterudites via Suppressing Bipolar Effects and Enhanced Phonon Scattering

Wenwei Yang, Minhui Yuan, Zhanpeng Zhao, Zijie Ren, Zhixing Chen, Jing Shuai, Yanglong Hou, Jing‐Feng Li, Hailong Yang, Jingyi Lyu
article en
2 citations

Abstract

CoSb<sub>3</sub>-based skutterudites have great potential as midtemperature thermoelectric (TE) materials due to their low cost and excellent electrical and mechanical properties. Their application, however, is limited by the high thermal conductivity and the degradation of TE performance at elevated temperatures, attributed to the adverse effects of bipolar diffusion. Herein, a series of Se<sub><i>y</i></sub>Co<sub>4</sub>Sb<sub>12-<i>x</i></sub>Te<sub><i>x</i></sub> compounds were successfully synthesized by combining a solid-state reaction and spark plasma sintering techniques to mitigate these challenges. It was found that doping Te at the Sb sites effectively enhanced the carrier concentration and suppressed the bipolar effect to obtain a superior power factor of ∼43 μW cm<sup>-1</sup> K<sup>-2</sup>. Furthermore, due to the low resonant frequency of Se, filling voids of CoSb<sub>3</sub> with Se achieved a low lattice thermal conductivity of 1.55 W m<sup>-1</sup> K<sup>-1</sup>. Nevertheless, Se filling introduced additional holes, reducing the carrier concentration without a significant detriment of the carrier mobility. As a result, a maximum figure of merit of 1.23 was achieved for Se<sub>0.1</sub>Co<sub>4</sub>Sb<sub>11.55</sub>Te<sub>0.45</sub> at 773 K. This work provides a valuable guidance for selecting appropriate filling and doping components to achieve synergistic optimization of the acoustics and electronics of CoSb<sub>3</sub>-based skutterudites.

ACS Applied Materials & InterfacesVol. 16(38)
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Advanced Thermoelectric Materials and Devices
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