Development of Deep Ultraviolet LED Packaging

Deep ultraviolet light-emitting device (DUV-LED) package is a hotspot of growing concern for research scholars, it is through the LED semiconductor LEDs emit UVC band ultraviolet (typical wavelength 260 ∼ 280 nm), is a new type of healthy artificial light source, compared with the traditional UV light source mercury lamps, the DUV-LED has a wavelength of accurate and controllable, green. Due to the high-energy DUV-UV radiation capability, it has a strong bactericidal and inactivation effect on bacteria, viruses, and other microorganisms. In recent years, with the continuous progress of deep packaging technology, the optical efficiency and reliability of DUV-LEDs have been significantly improved. This paper summarizes the key technologies of DUV packaging, the performance of DUV-LEDs, and the application of DUV-LEDs, through the understanding of the packaging materials, packaging structure, packaging process, and so on to improve the performance of DUV-LEDs, so that it is better to apply to the market, which can be seen that the DUV-LEDs have a great prospect for development. Received: 27 February 2024 | Revised: 23 May 2024 | Accepted: 2 September 2024 Conflicts of Interest Jun Zou is an editorial board member for Journal of Optics and Photonics Research and was not involved in the editorial review or the decision to publish this article. The authors declare that they have no conflicts of interest to this work. Data Availability Statement Data are available from the corresponding author upon reasonable request. Author Contribution Statement Jichen Shen: Conceptualization, Methodology, Formal analysis, Investigation, Resources, Data curation, Writing – original draft, Visualization. Tianqi Wu: Software. Jun Zou: Writing – review & editing, Supervision. Peng Wu: Validation. Yitao Liao: Project administration.

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Publication Details

Journal
Journal of Optics and Photonics Research
Published
2024-09-10
DOI
https://doi.org/10.47852/bonviewjopr42022714
Citations
4
Primary Topic
Engineering Applied Research
Type
article
Field-Weighted Citation Impact
1.04

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article

Development of Deep Ultraviolet LED Packaging

Peng Wu, Jun Zou, T. L. Wu, Yitao Liao et al.
4 citations
Journal of Optics and Photonics Research
Engineering Applied Research
1.04
article

Development of Deep Ultraviolet LED Packaging

Peng Wu, Jun Zou, T. L. Wu, Yitao Liao, J. Shen
article en
4 citations

Abstract

Deep ultraviolet light-emitting device (DUV-LED) package is a hotspot of growing concern for research scholars, it is through the LED semiconductor LEDs emit UVC band ultraviolet (typical wavelength 260 ∼ 280 nm), is a new type of healthy artificial light source, compared with the traditional UV light source mercury lamps, the DUV-LED has a wavelength of accurate and controllable, green. Due to the high-energy DUV-UV radiation capability, it has a strong bactericidal and inactivation effect on bacteria, viruses, and other microorganisms. In recent years, with the continuous progress of deep packaging technology, the optical efficiency and reliability of DUV-LEDs have been significantly improved. This paper summarizes the key technologies of DUV packaging, the performance of DUV-LEDs, and the application of DUV-LEDs, through the understanding of the packaging materials, packaging structure, packaging process, and so on to improve the performance of DUV-LEDs, so that it is better to apply to the market, which can be seen that the DUV-LEDs have a great prospect for development. Received: 27 February 2024 | Revised: 23 May 2024 | Accepted: 2 September 2024 Conflicts of Interest Jun Zou is an editorial board member for Journal of Optics and Photonics Research and was not involved in the editorial review or the decision to publish this article. The authors declare that they have no conflicts of interest to this work. Data Availability Statement Data are available from the corresponding author upon reasonable request. Author Contribution Statement Jichen Shen: Conceptualization, Methodology, Formal analysis, Investigation, Resources, Data curation, Writing – original draft, Visualization. Tianqi Wu: Software. Jun Zou: Writing – review & editing, Supervision. Peng Wu: Validation. Yitao Liao: Project administration.

Journal of Optics and Photonics ResearchVol. 2(1)
Advanced Technology & Materials (China) (CN), Shanghai Institute of Technology (CN)
Government of Jiangsu Province
Openalex Percentile: Top 26%
Engineering Applied Research
1.04
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