Unlocking the potential of low-melting-point alloys integrated extrusion additive manufacturing: insights into mechanical behavior, energy absorption, and electrical conductivity

Abstract Additive manufacturing is a commonly used manufacturing method in complex part fabrication, instant assemblies, part consolidation, mass customization and personalization, on-demand manufacturing, lightweight, and topological optimization due to its advantage of lower costs, flexibility to learn and use, reduced raw material wastage, digital design integration, high efficiency, environmental-friendliness. However, the current metal 3D printing, which is mainly fabricated layer by layer using laser, is expensive to manufacture metal parts. Therefore, in this paper, a low-cost high-quality metal manufacturing process called low-melting-point alloys (LMPAs) integrated extrusion additive manufacturing will be examined. This manufacturing process can fabricate complex metal structures and integrated circuits with simple fused deposition modeling, which is a cost-effective method for producing these objects. LMPAs with different melting points are used for performance comparison to find out the optimized mechanical behavior, energy absorption properties, and electrical conductivity. Our investigation into LMPAs integrated extrusion additive manufacturing has revealed significant findings. Tensile tests conducted on LMPAs with varying melting points have illuminated distinct mechanical behaviors. Notably, lower melting points contribute to increased ductility but reduced stiffness, while higher melting points result in greater stiffness but diminished ductility. These results emphasize the importance of tailoring LMPA selection based on specific application requirements. Furthermore, our examination of lattice and triply periodic minimal surface structures has demonstrated consistent energy absorption properties across different manufacturing temperatures, highlighting the adaptability and versatility of LMPAs for energy absorption applications. Additionally, our electrical conductivity assessments have shown that LMPAs with melting points of $${{47}^{\circ }C}$$ <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"> <mml:mrow> <mml:msup> <mml:mrow> <mml:mn>47</mml:mn> </mml:mrow> <mml:mo>∘</mml:mo> </mml:msup> <mml:mi>C</mml:mi> </mml:mrow> </mml:math> and $${{120}^{\circ }}\hbox {C}$$ <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"> <mml:mrow> <mml:msup> <mml:mrow> <mml:mn>120</mml:mn> </mml:mrow> <mml:mo>∘</mml:mo> </mml:msup> <mml:mtext>C</mml:mtext> </mml:mrow> </mml:math> exhibit higher electrical conductivity, making them suitable for applications requiring good electrical conduction properties. These findings collectively underscore the significance of LMPAs in additive manufacturing, offering valuable insights for material selection and applications in various domains.