Optimized Fabrication of Flexible Paper‐Based PCBs with Pencil and Copper Electroplating

Abstract This research unveils a transformative methodology for fabricating flexible printed circuit boards (PCBs), focusing on the unique attributes of filter paper substrates. A meticulous parametric exploration scrutinizes critical aspects such as buckling resistance, charging current, plating time, and electrode configurations for copper electroplating. Key findings highlight the exceptional stability of copper electroplating on filter paper, exhibiting robust resistance against environmental variations and bending angles spanning +180° to −180°. Utilizing higher pencil grade material and maintaining a minimum 4 cm distance with a voltage range of 3 to 1.44 V ensures uniform, controlled plating without burning, optimizing the electrode area below 1 cm 2 for enhanced practicality. The research underscores the longevity and durability of copper‐plated filter paper, with negligible resistance changes even after 1000 folds. Over a year, the shelf‐life assessment emphasizes the excellent stability of electroplated filter paper. Practical applications, including fully functional circuits and a bio‐degradable piano, underscore the versatility and real‐world feasibility of the proposed electroplating technique.