UCIe: Standard for an Open Chiplet Ecosystem

Universal chiplet interconnect express (UCIe) is an open industry standard die-to-die physical layer, link layer, and protocol layer for chiplets. It has industry-leading key performance indicators (KPIs) and has successfully coalesced the industry around a common die-to-die specification. The ultimate goal of UCIe is to enable the rapid creation of system-in-package (SiP) solutions from an open ecosystem where chiplets are designed and manufactured by different vendors and are offered as standard products. This paper provides an overview of existing UCIe technology and highlights the work being done to create the next layer of standards required for an open chiplet ecosystem.