The Copper Connection: Hybrid Bonding is the 3D-Chip Tech That's Saving Moore's Law

Chipmakers continue to claw for every spare nano-meter to continue scaling down circuits, but a technology involving things that are much bigger—hundreds or thousands of nanometers across—could be just as significant over the next five years.

Authors

Publication Details

Journal
IEEE Spectrum
Published
2024-09-01
DOI
https://doi.org/10.1109/mspec.2024.10669241
Citations
2
Primary Topic
Manufacturing Process and Optimization
Type
article
Field-Weighted Citation Impact
0.70
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article

The Copper Connection: Hybrid Bonding is the 3D-Chip Tech That's Saving Moore's Law

Samuel K. Moore
2 citations
IEEE Spectrum
Manufacturing Process and Optimization
0.70
article

The Copper Connection: Hybrid Bonding is the 3D-Chip Tech That's Saving Moore's Law

Samuel K. Moore
article en
2 citations

Abstract

Chipmakers continue to claw for every spare nano-meter to continue scaling down circuits, but a technology involving things that are much bigger—hundreds or thousands of nanometers across—could be just as significant over the next five years.

IEEE SpectrumVol. 61(9)
Peace, Justice and strong institutions
Openalex Percentile: Top 26%
Manufacturing Process and Optimization
0.70
DOISourceOpenAlex
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The Copper Connection: Hybrid Bonding is the 3D-Chip Tech That's Saving Moore's Law — Samuel K. Moore · IEEE Spectrum (2024) | TGRS Research Map | TGRS