Improvement of Reflectance Spectroscopy for Oxide Layers on 4H-SiC
In this work, we investigate the use of reflectance spectroscopy as an accurate, fast, and non-destructive method for measuring the thickness of transparent layers, such as SiO 2 , with thicknesses below 200 nm for microelectronic applications. To this end, we fabricated different oxides and analyzed their reflectance spectra using reflectance spectroscopy. The results were compared to theoretical reflectance spectra to validate the method. We introduce key factors to ensure accurate measurement by modeling the reflectance spectra of thin oxide layers with thicknesses ≥ 15 nm on 4H-SiC using the transfer matrix method (TMM).
Authors
- Mathias Rommel (ORCID: https://orcid.org/0000-0002-1141-3228)
- Oleg Rusch (ORCID: https://orcid.org/0009-0009-4276-5785)
- A.M. Fuchs (ORCID: https://orcid.org/0009-0000-7491-9333)
- Julien Koerfer
Institutions
- Fraunhofer Institute for Integrated Systems and Device Technology (DE)
Publication Details
- Journal
- Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena
- Published
- 2024-08-21
- DOI
- https://doi.org/10.4028/p-lm74bm
- Primary Topic
- Silicon Carbide Semiconductor Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00