Carrier-phonon decoupling in perovskite thermoelectrics via entropy engineering
Thermoelectrics converting heat and electricity directly attract broad attentions. To enhance the thermoelectric figure of merit, zT, one of the key points is to decouple the carrier-phonon transport. Here, we propose an entropy engineering strategy to realize the carrier-phonon decoupling in the typical SrTiO<sub>3</sub>-based perovskite thermoelectrics. By high-entropy design, the lattice thermal conductivity could be reduced nearly to the amorphous limit, 1.25 W m<sup>-1</sup> K<sup>-1</sup>. Simultaneously, entropy engineering can tune the Ti displacement, improving the weighted mobility to 65 cm<sup>2</sup> V<sup>-1</sup> s<sup>-1</sup>. Such carrier-phonon decoupling behaviors enable the greatly enhanced μ<sub>W</sub>/κ<sub>L</sub> of ~5.2 × 10<sup>3</sup> cm<sup>3</sup> K J<sup>-1</sup> V<sup>-1</sup>. The measured maximum zT of 0.24 at 488 K and the estimated zT of ~0.8 at 1173 K in (Sr<sub>0.2</sub>Ba<sub>0.2</sub>Ca<sub>0.2</sub>Pb<sub>0.2</sub>La<sub>0.2</sub>)TiO<sub>3</sub> film are among the best of n-type thermoelectric oxides. These results reveal that the entropy engineering may be a promising strategy to decouple the carrier-phonon transport and achieve higher zT in thermoelectrics.
Authors
- Yueyang Yang (ORCID: https://orcid.org/0000-0001-5118-4602)
- Lvye Dou (ORCID: https://orcid.org/0000-0002-3766-6864)
- Yang Lu (ORCID: https://orcid.org/0000-0002-0946-7155)
- Lin Gu (ORCID: https://orcid.org/0000-0002-7504-031X)
- Bin Wei (ORCID: https://orcid.org/0000-0003-0125-1760)
- Weigang Ma (ORCID: https://orcid.org/0000-0003-0178-3994)
- Di Yi (ORCID: https://orcid.org/0000-0002-7209-1947)
- Yunpeng Ma
- Changpeng Lin (ORCID: https://orcid.org/0000-0002-6405-2390)
- Yunpeng Zheng (ORCID: https://orcid.org/0000-0002-5178-2212)
- Hetian Chen (ORCID: https://orcid.org/0000-0003-4505-403X)
- Jinle Lan (ORCID: https://orcid.org/0000-0001-6844-0879)
- Mingchu Zou (ORCID: https://orcid.org/0000-0003-1585-3113)
- Ce‐Wen Nan (ORCID: https://orcid.org/0000-0002-3261-4053)
- Chang Liu (ORCID: https://orcid.org/0000-0001-5271-0723)
- Dongliang Yang
- Zhifang Zhou (ORCID: https://orcid.org/0000-0002-4359-1731)
- Wei Xu (ORCID: https://orcid.org/0000-0003-4750-4428)
- Qinghua Zhang (ORCID: https://orcid.org/0000-0001-9086-7000)
- Qian Li (ORCID: https://orcid.org/0000-0001-7922-598X)
- Wenyu Zhang (ORCID: https://orcid.org/0000-0002-1924-6591)
- Xing Zhang (ORCID: https://orcid.org/0000-0002-7545-0773)
- Yujun Zhang (ORCID: https://orcid.org/0000-0003-4892-1100)
- Jian Han (ORCID: https://orcid.org/0000-0002-2335-830X)
- Yuanhua Lin (ORCID: https://orcid.org/0000-0002-5652-6701)
- Caijuan Shi
- Bingbing Yang
Institutions
- Chinese Academy of Sciences (CN)
- Rome International Center for Materials Science (IT)
- Institute of High Energy Physics (CN)
- Institute of Solid State Physics (CN)
- Institute of Physics (CN)
- National Laboratory for Superconductivity (CN)
- Henan Polytechnic University (CN)
- State Key Laboratory of New Ceramics and Fine Processing
- École Polytechnique Fédérale de Lausanne (CH)
- Beijing University of Chemical Technology (CN)
- Fuzhou University (CN)
- Tsinghua University (CN)
Publication Details
- Journal
- Nature Communications
- Published
- 2024-09-03
- DOI
- https://doi.org/10.1038/s41467-024-52063-5
- Citations
- 40
- Primary Topic
- Advanced Thermoelectric Materials and Devices
- Type
- article
- Field-Weighted Citation Impact
- 4.69
Funders
- National Science Foundation
- National Natural Science Foundation of China
- China Postdoctoral Science Foundation
- Tsinghua University