High-Temperature Reorganization Behavior of Single-Crystalline Porous 4H-SiC Thin Foils

This work reports on the high-temperature reorganization behavior of single-crystalline porous 4H-silicon carbide (4H-SiC) thin foils. Porous 4H-SiC thin foils are realized via state-of-the-art photoelectrochemical etching in hydrofluoric (HF) acid solution enabling for the first time a released foil with a diameter of 2 inches. Subsequent annealing under inert gas atmosphere and comparison between samples suggests that a temperature of 1500 °C allows for various degrees of compactification across the foil surface, whereas at 1600 °C single crystallinity can be preserved.

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Publication Details

Journal
Materials science forum
Published
2024-08-21
DOI
https://doi.org/10.4028/p-d0xoyc
Citations
1
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.21

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High-Temperature Reorganization Behavior of Single-Crystalline Porous 4H-SiC Thin Foils

U. Schmid, Appu Vengattoor Raghu, Georg Pfusterschmied, A. Kirnbauer et al.
1 citations
Materials science forum
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article

High-Temperature Reorganization Behavior of Single-Crystalline Porous 4H-SiC Thin Foils

U. Schmid, Appu Vengattoor Raghu, Georg Pfusterschmied, A. Kirnbauer, Christopher Zellner, Rainer Hahn, Sabine Schwarz, Markus Leitgeb, Marco Perazzi
article en
1 citations

Abstract

This work reports on the high-temperature reorganization behavior of single-crystalline porous 4H-silicon carbide (4H-SiC) thin foils. Porous 4H-SiC thin foils are realized via state-of-the-art photoelectrochemical etching in hydrofluoric (HF) acid solution enabling for the first time a released foil with a diameter of 2 inches. Subsequent annealing under inert gas atmosphere and comparison between samples suggests that a temperature of 1500 °C allows for various degrees of compactification across the foil surface, whereas at 1600 °C single crystallinity can be preserved.

Materials science forumVol. 1124
TU Wien (AT)
Österreichische Nationalstiftung für Forschung, Technologie und Entwicklung, Christian Doppler Forschungsgesellschaft
Openalex Percentile: Top 49%
Silicon Carbide Semiconductor Technologies
0.21
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