Practical Application of Liquid Compression Mold Underfill

In recent years, the technical advancement of semiconductor packages has driven a shift to larger die sizes and narrower bump pitches for high performance. The challenge is to develop both encapsulation materials and encapsulation processes suitable for such complicated semiconductor packages for higher performance.

Authors

Tsuyoshi Kamimura

Publication Details

Journal: Journal of The Japan Institute of Electronics Packaging
Published: 2024-08-31
DOI: https://doi.org/10.5104/jiep.27.561
Primary Topic: Electronic Packaging and Soldering Technologies
Type: article
Field-Weighted Citation Impact: 0.00

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article

Practical Application of Liquid Compression Mold Underfill

Tsuyoshi Kamimura

Aug 31, 2024

Journal of The Japan Institute of Electronics Packaging

Electronic Packaging and Soldering Technologies

article

Practical Application of Liquid Compression Mold Underfill

Tsuyoshi Kamimura

August 31, 2024article en

Abstract

Journal of The Japan Institute of Electronics PackagingVol. 27(6)

Openalex Percentile: Top 88%

Electronic Packaging and Soldering Technologies

DOI Source OpenAlex

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Practical Application of Liquid Compression Mold Underfill — Tsuyoshi Kamimura · Journal of The Japan Institute of Electronics Packaging (2024) | TGRS Research Map | TGRS