A Study on Solving the Problem of Semiconductor Chip Crack using TRIZ's Technological Contradiction Model

Recently, when competition among semiconductor companies has been fierce, numerous problems have occurred at the site.As for the characteristics of semiconductor products, as customers' demand for high-density products increases, the post-process package structure is to miniaturize further light, thin, short, and small.According to the Thin Die and High Stack, chip cracking, which was not a problem in the past, is entering an area where it is increasingly impossible to overcome the limitations of technology.In this situation, this study aims to minimize the existing trial and error of the problem of chip cracking in the semiconductor manufacturing site and to present effective problem-solving.Therefore, two case studies were conducted to solve the problem of semiconductor chip cracking.As a result, case B's improvement time was shortened by about 67% compared to case A. While the chip detach method was improved by optimization after benchmarking by other companies, the chip compression mechanism could derive ideal results through TRIZ's technology contradiction model.This proved that TRIZ is a tool that can minimize side effects before problem improvement.In addition, through TRIZ's technology contradiction situation, we sought ways to shorten the improvement period by defining the problem situation and solving the contradiction.In addition, it was intended to present an improvement guide to strengthen the preemptive response to new products that require environmental conditions that are vulnerable to chip cracking and to secure mass production.In addition, the overall optimization was proposed through collaboration when performing tasks, which is expected to be useful to corporate practitioners who will perform future tasks.