Recent Advences in Laser and Laser-Assisted Bonding (LAB) Technologies for Micro-Soldering and Applications to Mini-LED

Advancements in laser soldering and laser-assisted bonding (LAB) have revolutionized electronic manufacturing by enhancing solder joint formation with precise control, reduced thermal impact, and improved reliability. These technologies are crucial for high-density assemblies in advanced electronics, supporting miniaturization and increasing functionality. This paper introduces recent advancements in laser and LAB technologies for micro-soldering. The paper describes Nd:YAG and diode lasers, their micro-soldering results, the microstructure of the solder joint, and the author's LAB application to mini-LEDs using type-8 SAC305 solder paste. Future advancements in laser technology will further improve soldering and bonding techniques to ensure the reliability and performance of smaller, more complex electronic devices.