The influence of graphene oxide on the microstructure and properties of ultrafine-grained copper processed by high-pressure torsion

New metal matrix nanocomposites with enhanced thermal stability were produced in a three step process consisting of mechanical milling, spark plasma sintering and High-Pressure Torsion (HPT). The nanocomposites consisted of a copper matrix and the addition of 1 wt% Graphene Oxide (GO) as a reinforcement. A nanocrystalline microstructure, enhanced hardness and improved thermal stability were achieved. The grain size of the nanocomposites was ∼55 nm which is almost four time smaller than for Cu HPT at 210 nm. Hardnes and ultimate tensile strength of the nanocomposites reach 250 Hv and 700 MPa, respectively, which was more than three times higher than for the initial material. The most important result is that the nanocomposites remained ultrafine-grained up to 500 ⁰C whereas the Cu HPT fully recrystalized after annealing at 300 ⁰C The report also includes an investigation of the electrical conductivity of the copper-based composite which was slightly better than for copper after HPT together with the wear behaviour of this material. This is one of the first reports on copper reinforced with graphene oxide composites produced by HPT and it gives information on its thermal stability, electrical conductivity and wear behaviour together with the microstructural characteristics and mechanical properties.