Low-Damage Trimming of Micro Hemispherical Resonators by Chemical Etching

To enhance the performance of micro-hemispherical gyroscopes, achieving low-damage and high-surface-quality trimming is essential. This enables greater stability and reliability for the gyroscopes. Current methods for reducing frequency split often come with drawbacks such as high cost, adverse effects on the Q-factor, or surface damage. In this paper, a chemical etching trimming method is proposed to reduce frequency split in micro-hemispherical resonators. This method allows for trimming with minimal damage, while also being cost-effective and easy to implement. The theoretical basis of this method was analyzed, followed by a simulation to determine the optimal trimming range and location on the resonator. The simulated Q-factor analysis before and after trimming preliminarily validated the method's low-damage characteristics. Ultimately, the frequency split of the resonator was reduced to below 1 Hz. Additionally, test results of the Q-factor and surface quality before and after trimming further confirmed that chemical etching offers effective low-damage trimming capabilities. The proposed method holds significant potential for improving the performance of micro-hemispherical resonator gyroscopes.