Experimental Demonstration of Ultra-Fast SiC MOSFET Overload Protection Using Embedded Current and Temperature Sensors

Fault protection of AC and DC network using semiconductors requires accurate electrothermal design of active and passive devices to keep power losses low in nominal condition and to sustain high current overload. Using SiC MOSFET for SSPC arises challenges to keep power losses low and to ensure robustness versus abnormal operating condition. Indeed, unpredictable events can dramatically damage the device integrity such as current overload, short-circuit... To overcome those issues, ones are generally carefully design driving system, implementing sensors and fast digital control circuit computing to sense simultaneously current, voltage and temperature, to analyze and detect abnormal operating condition. To reduce the whole detection transmission and reaction chain, we have designed a 1200V ; 30A ; 65mΩ instrumented SiC MOSFET, including both a current mirror and a temperature sensor in the active area of the die. This paper reports for the first-time real-time SiC instrumented MOSFET temperature and current measurement without the need of external sensors nor estimators.

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Publication Details

Journal
Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena
Published
2024-08-26
DOI
https://doi.org/10.4028/p-uhkt8i
Citations
1
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.21
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Experimental Demonstration of Ultra-Fast SiC MOSFET Overload Protection Using Embedded Current and Temperature Sensors

Pascal Bevilacqua, Dominique Tournier, Pierre Brosselard, Thomas Vadebout et al.
1 citations
Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena
Silicon Carbide Semiconductor Technologies
0.21
article

Experimental Demonstration of Ultra-Fast SiC MOSFET Overload Protection Using Embedded Current and Temperature Sensors

Pascal Bevilacqua, Dominique Tournier, Pierre Brosselard, Thomas Vadebout, Jean François de Palma
article en
1 citations

Abstract

Fault protection of AC and DC network using semiconductors requires accurate electrothermal design of active and passive devices to keep power losses low in nominal condition and to sustain high current overload. Using SiC MOSFET for SSPC arises challenges to keep power losses low and to ensure robustness versus abnormal operating condition. Indeed, unpredictable events can dramatically damage the device integrity such as current overload, short-circuit... To overcome those issues, ones are generally carefully design driving system, implementing sensors and fast digital control circuit computing to sense simultaneously current, voltage and temperature, to analyze and detect abnormal operating condition. To reduce the whole detection transmission and reaction chain, we have designed a 1200V ; 30A ; 65mΩ instrumented SiC MOSFET, including both a current mirror and a temperature sensor in the active area of the die. This paper reports for the first-time real-time SiC instrumented MOSFET temperature and current measurement without the need of external sensors nor estimators.

Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomenaVol. 361
Université Claude Bernard Lyon 1 (FR), Mersen (France) (FR), Institut National des Sciences Appliquées de Lyon (FR)
Affordable and clean energy
Openalex Percentile: Top 49%
Silicon Carbide Semiconductor Technologies
0.21
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Experimental Demonstration of Ultra-Fast SiC MOSFET Overload Protection Using Embedded Current and Temperature Sensors — Pascal Bevilacqua, Dominique Tournier, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena (2024) | TGRS Research Map | TGRS