Demonstration of 800°C SiC MOSFETs for Extreme Temperature Applications
Silicon Carbide (SiC) enhancement mode MOS electronics offer several benefits for realizing analog, digital and mixed signal electronics, but limitations on gate dielectric reliability has limited the adoption of MOS in high temperature application. In this work, we report GE’s lateral SiC MOSFETs exceeding previously reported temperature capabilities for SiC MOSFETs with experimental results that have shown that >500°C operation of SiC MOSFETS is possible with >400 hours demonstrated at 620°C, and short-term functionality demonstrated to 800°C. The result shows that MOS-based SiC electronics can continue to be a viable choice for circuit implementations at extreme temperatures >600°C.
Authors
- Emad Andarawis (ORCID: https://orcid.org/0000-0002-6446-9970)
- Reza Ghandi
- David Shaddock
- Tammy Johnson
- Shubhodeep Goswami
Institutions
- GE Global Research (United States) (US)
- General Electric (Norway) (NO)
Publication Details
- Journal
- Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena
- Published
- 2024-08-26
- DOI
- https://doi.org/10.4028/p-npiby5
- Citations
- 2
- Primary Topic
- Silicon Carbide Semiconductor Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.42