High Single-Event Burnout Resistance 1.2 kV 4H-SiC Schottky Barrier Diode

A 1.2 kV lateral RESURF Schottky diode (TZ-SBD) have been designed from SZ-SBD that can recover from a single-event effect (SEE) in which a heavy ion traverses the device at a linear energy transfer (LET) of 60 MeV·cm²/mg, ESA’s standard. Compared to SZ-SBD, TZ-SBD has an additional split in the N-drift region which is usually used to improve the electric field distribution so its breakdown voltage is improved by 9%. During the single events simulations, the maximum temperature is 919 K with reverse voltage (VR) = 1200 V and LET = 60 MeV·cm²/mg, which is much lower then the SiC melting temperature (3100 K) and the chemically unstable temperature of SiC in the presence of metal (1073 K).

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Publication Details

Journal
Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena
Published
2024-08-26
DOI
https://doi.org/10.4028/p-hytk19
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.00

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article

High Single-Event Burnout Resistance 1.2 kV 4H-SiC Schottky Barrier Diode

Marina Antoniou, Peter Michael Gammon, Arne Benjamin Renz, Virendra Kotagama et al.
Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena
Silicon Carbide Semiconductor Technologies
article

High Single-Event Burnout Resistance 1.2 kV 4H-SiC Schottky Barrier Diode

Marina Antoniou, Peter Michael Gammon, Arne Benjamin Renz, Virendra Kotagama, Yun Yi Qi
article en

Abstract

A 1.2 kV lateral RESURF Schottky diode (TZ-SBD) have been designed from SZ-SBD that can recover from a single-event effect (SEE) in which a heavy ion traverses the device at a linear energy transfer (LET) of 60 MeV·cm²/mg, ESA’s standard. Compared to SZ-SBD, TZ-SBD has an additional split in the N-drift region which is usually used to improve the electric field distribution so its breakdown voltage is improved by 9%. During the single events simulations, the maximum temperature is 919 K with reverse voltage (VR) = 1200 V and LET = 60 MeV·cm²/mg, which is much lower then the SiC melting temperature (3100 K) and the chemically unstable temperature of SiC in the presence of metal (1073 K).

Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomenaVol. 361
University of Warwick (GB)
Engineering and Physical Sciences Research Council
Affordable and clean energy
Openalex Percentile: Top 89%
Silicon Carbide Semiconductor Technologies
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