UIS Ruggedness of Parallel 4H-SiC MOSFETs
We have studied the UIS (Unclamped Inductive Switching) ruggedness of SiC MOSFETs in parallel. We show that UIS ruggedness of parallel MOSFETs is a function of the difference in their breakdown voltage (Δ-BVDSS). As expected, for large Δ-BVDSS UIS, ruggedness is dominated by the lower BVDSS transistor. Somewhat unexpectedly, for small enough Δ-BVDSS, UIS ruggedness is better than the sum of its two transistors. Specifically, the energy that parallel transistors of low Δ-BVDSS can sustain depends on the peak current and is 10%-20% higher than the sum of the energies of the individual transistors. We explain the physical mechanism of this effect and extend the concept to the case of more than 2 parallel transistors. These findings are important for the efficient design of power circuits with multiple die in parallel.
Authors
- In Hwan Ji
- Philipp Steinmann (ORCID: https://orcid.org/0000-0001-8446-0706)
- Rahul Potera (ORCID: https://orcid.org/0000-0002-8122-0309)
- Kevin J. Myers
- Neal Oldham
- Edward Van Brunt
- Marco Atzeri
- Jae Hyung Park (ORCID: https://orcid.org/0000-0002-5043-9455)
- Caleb Rinderer
- Jared Langan
Institutions
- Wolfram Research (United States) (US)
Publication Details
- Journal
- Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena
- Published
- 2024-08-26
- DOI
- https://doi.org/10.4028/p-ostn6y
- Citations
- 1
- Primary Topic
- Silicon Carbide Semiconductor Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.21