Characterization of Micro-Holes Drilled Using a UV Femtosecond Laser in Modified Polyimide Flexible Circuit Boards

Modified polyimide (MPI) flexible printed circuits (FPCs) are used as chip carrier boards. The quality of the FPC directly affects the reliability of the integrated circuit. Furthermore, micro-holes are critical components of FPCs. In this study, an ultraviolet (UV) femtosecond laser is used to drill micro-holes in double-layer flexible circuit boards with MPI as the substrate. The morphology of the micro-hole wall in the copper foil and MPI layer is observed, and the effects of the laser processing parameters on the diameter and depth of the micro-holes are analyzed. The drilling process and mechanism of micro-holes obtained using a UV femtosecond laser in MPI FPCs are discussed. The results show that the morphology of femtosecond laser-machined copper is closely related to the laser energy, and a periodic structure is observed during the machining process. Copper, MPI, and copper oxides are the most common molten deposits in micro-holes during drilling. The depth of the micro-holes increases with an increase in the energy of a single pulse, scanning time, and scanning overlap rate of the laser beam. However, the diameter exhibits no discernible alteration. The material removal rate increased significantly when laser processing was applied to the MPI resin layer.