Role of AI and ML in Reducing Testing Costs and Improving Yield of High Density SoCs

High -density System on Chips (SoCs) present significant challenges in testing and yield optimization due to their complex design and manufacturing processes.Traditional methods of testing and yield improvement are increasingly inadequate in addressing the intricacies and cost -efficiency demanded by modern SoCs.This paper explores the transformative role of Artificial Intelligence (AI) and Machine Learning (ML) in reducing testing costs and improving yield.By leveraging AI and ML techniques, it is possible to enhance test generation, optimize test execution, and analyze manufacturing data more effectively.These advancements lead to more efficient defect detection, reduced test time, and improved overall yield.