A Geometry-Scalable Physically-Based SPICE Compact Model for SiC MPS Diodes Including the Snapback Mechanism
In this paper, a simple compact model for the static behavior of SiC MPS diodes is developed in the form of a SPICE-compatible subcircuit. The model is suited to describe the undesired snapback mechanism likely to occur in unoptimized high-voltage MPS structures with narrow width of the PiN portion and/or very thick drift layer; in particular, the model accounts for the snapback mechanism both as the cell extension varies and as individual portions of Schottky and PiN vary. Sentaurus TCAD simulations of a 10-kV MPS diode are used as a reference for the calibration of the model parameters and accuracy verification.
Authors
- Alessandro Borghese (ORCID: https://orcid.org/0000-0002-6285-4242)
- Vincenzo d’Alessandro (ORCID: https://orcid.org/0000-0003-1426-371X)
- Andrea Irace (ORCID: https://orcid.org/0000-0003-1400-8380)
- V. Terracciano
- Marco Boccarossa (ORCID: https://orcid.org/0000-0002-6912-5413)
Institutions
- Federico II University Hospital (IT)
Publication Details
- Journal
- Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena
- Published
- 2024-08-23
- DOI
- https://doi.org/10.4028/p-b9imzl
- Citations
- 1
- Primary Topic
- Silicon Carbide Semiconductor Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.21