3-D Printed All-Dielectric Ultrabroadband Microwave Absorber
A dielectric resonator-based ultrabroadband microwave absorber is proposed. The first and second iterations of the Minkowski fractal are exploited to design the final unit cell geometry. The final prototype is an all-dielectric microwave absorber and is fabricated using 3-D printing technology. Conventional microwave absorbers are usually made up of metal, dielectric, resistive, or active components, while the proposed absorber is fabricated using just dielectric material, hence the name all-dielectric. This all-dielectric absorber offers absorption from 2.54–40 GHz at normal incidence. For TE mode, absorption is stable up to 40<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$^{\circ }$</tex-math></inline-formula> and up to 60<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$^{\circ }$</tex-math></inline-formula> for TM mode. The ultrawide band with its −10 dB fractional bandwidth up to 176<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\%$</tex-math></inline-formula> is achieved using single technology and one-step fabrication. Measurement results are in good agreement with simulation. The presented work opens new dimensions to explore all-dielectric mechanically robust microwave absorbers. Therefore, it is suitable for use in harsh environments without any post-processing treatment.
Authors
- J. Ramkumar (ORCID: https://orcid.org/0000-0002-3578-7283)
- Rahul Vishwakarma (ORCID: https://orcid.org/0009-0005-7929-5941)
- Kumar Vaibhav Srivastava (ORCID: https://orcid.org/0000-0001-6059-6203)
- Mondeep Saikia (ORCID: https://orcid.org/0000-0001-8283-7311)
- Jyoti Yadav (ORCID: https://orcid.org/0000-0002-2834-6463)
Institutions
- Queen's University Belfast (GB)
- Indian Institute of Technology Kanpur (IN)
Publication Details
- Journal
- IEEE Transactions on Electromagnetic Compatibility
- Published
- 2024-08-23
- DOI
- https://doi.org/10.1109/temc.2024.3440060
- Citations
- 7
- Primary Topic
- Advanced Antenna and Metasurface Technologies
- Type
- article
- Field-Weighted Citation Impact
- 9.09