Investigation of SiN<sub>x</sub>:H Surface Passivation Impact on InAsP/InGaAs e-SWIR Photodiodes
In this study, we investigate the deposition of SiNx:H thin films using the inductively coupled plasma chemical vapor deposition (ICPCVD) method with NH3/SiH4 ratios ranging from 1.3 to 25. The impacts of these variations on extended short-wave infrared region (e-SWIR) photodiodes (PDs) were characterized through stress, reflectance, photoresponse, and dark current modeling techniques. It was observed that an increase in H content leads to a decrease in both the refractive index and stress. To reveal the effects of H content on the bond numbers of N-H, Si-H, and Si-N within SiNx:H, FTIR measurements were conducted. This allowed us to investigate the K<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$^{-}$ </tex-math></inline-formula> trap centers depending on the change in NH3/SiH4 ratios. The influence of H content on the passivation layer was examined through dark current modeling and PD performance evaluations. The optimized passivation layer underscores that the dark current of the PD is G-R limited, with diffusion current emerging as the dominant component at high temperatures. Additionally, the PD performance was enhanced with optimized passivation, achieving a higher photo-to-dark current ratio, a responsivity of 0.97 A/W at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2~\mu $ </tex-math></inline-formula>m, an external quantum efficiency (E.Q.E.) peak of 70.8% at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$1.6~\mu $ </tex-math></inline-formula>m, and a dark current density of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$120~\mu $ </tex-math></inline-formula>A/cm2 at 300 K under a 100 mV reverse bias voltage.
Authors
- Fikri Oğuz (ORCID: https://orcid.org/0000-0002-5443-3472)
- Iwona Pasternak (ORCID: https://orcid.org/0000-0002-3393-4593)
- Włodek Strupiński (ORCID: https://orcid.org/0000-0001-7887-8452)
- Walery Kołkowski
- Ekmel Özbay (ORCID: https://orcid.org/0000-0003-2953-1828)
- Mert Satılmış (ORCID: https://orcid.org/0000-0001-7913-2708)
- İrfan Alp Gezgin (ORCID: https://orcid.org/0000-0002-8526-6734)
- Çağrı Tok (ORCID: https://orcid.org/0000-0002-6864-8298)
- Habibe Keleş (ORCID: https://orcid.org/0009-0002-6691-3972)
Institutions
- Bilkent University (TR)
- Vigo System (Poland) (PL)
Publication Details
- Journal
- IEEE Sensors Journal
- Published
- 2024-08-23
- DOI
- https://doi.org/10.1109/jsen.2024.3443747
- Citations
- 4
- Primary Topic
- Integrated Circuits and Semiconductor Failure Analysis
- Type
- article
- Field-Weighted Citation Impact
- 0.83