Reduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compound

• Developed compression molding monitoring system reveals cure shrinkage behavior of epoxy molding compound in curing stages. • FEA considering viscoelastic properties and cure shrinkage accurately predicts warpage behavior of bi-material dummy package. • Optimized post-cure temperature profile reduces bi-material dummy package warpage threefold, enhancing package reliability. Warpage in semiconductor packages is a critical issue that affects their reliability and performance. This study aims to minimize the warpage of a bi-material dummy package by optimizing the post-mold curing (PMC) temperature profile. A warpage simulation model was developed considering the viscoelastic properties and cure shrinkage behavior of the epoxy molding compound (EMC). A compression molding monitoring system was also developed to analyze the cure behavior of the EMC. The gelation point of the EMC during compression molding was determined using a dielectric sensor, while cure shrinkage behaviors were analyzed using a fiber Bragg grating sensor. Viscoelastic properties were characterized through stress relaxation tests, and thermal properties were measured using three-dimensional digital image correlation. The developed simulation model was used to optimize the PMC temperature profile using a genetic algorithm. Experimental validation showed that the optimized temperature profile reduced the warpage from ∼1519 μm to 486 μm compared to a linear profile. The findings of this study have broader implications for the design and manufacturing of semiconductor packages, as the proposed approach can be applied to minimize warpage and improve package reliability.