Experimental study of Hf-Cu-Sn ternary system at 870 K

Interaction of hafnium with copper and tin was studied at 870 K over the whole concentration range using X-ray diffractometry and scanning electron microscopy. At the temperature of investigation three ternary compounds are realized in the Hf-Cu-Sn system: HfCuSn (LiGaGe-type), HfCu5Sn2 (HfCu5Sn2-type), and Hf5CuSn3 (Hf5CuSn3-type). New HfCu5Sn2 ternary stannide crystallizes in the hexagonal space group P63/mmc with cell parameters a = 0.42959(7) nm, с = 1.54165(4) nm. Electrical transport properties indicated metallic type of conductivity of the all studied ternary compounds. The DFT calculations were used to evaluate chemical bonding, elastic and physical properties of the ternary phases.

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Publication Details

Journal
Physics and Chemistry of Solid State
Published
2024-08-22
DOI
https://doi.org/10.15330/pcss.25.3.485-491
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
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article

Experimental study of Hf-Cu-Sn ternary system at 870 K

А. Horyn, Yu. Stadnyk, V.V. Romaka, V.V. Romaka
Physics and Chemistry of Solid State
Electronic Packaging and Soldering Technologies
article

Experimental study of Hf-Cu-Sn ternary system at 870 K

А. Horyn, Yu. Stadnyk, V.V. Romaka, V.V. Romaka
article en

Abstract

Interaction of hafnium with copper and tin was studied at 870 K over the whole concentration range using X-ray diffractometry and scanning electron microscopy. At the temperature of investigation three ternary compounds are realized in the Hf-Cu-Sn system: HfCuSn (LiGaGe-type), HfCu5Sn2 (HfCu5Sn2-type), and Hf5CuSn3 (Hf5CuSn3-type). New HfCu5Sn2 ternary stannide crystallizes in the hexagonal space group P63/mmc with cell parameters a = 0.42959(7) nm, с = 1.54165(4) nm. Electrical transport properties indicated metallic type of conductivity of the all studied ternary compounds. The DFT calculations were used to evaluate chemical bonding, elastic and physical properties of the ternary phases.

Physics and Chemistry of Solid StateVol. 25(3)
Clean water and sanitation
Openalex Percentile: Top 89%
Electronic Packaging and Soldering Technologies
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