Nanosecond laser processing of silicon carbide groove structure

Abstract Through orthogonal experiments, this work explores and improves the laser parameters that affect bottom surface roughness and groove depth in silicon carbide grooves produced by nanosecond pulse laser machining. According to the findings, a frequency of 20 kHz, scanning speed of 400 mm/s, laser power of 18 W, path interval of 0.02 mm, and depth of 411.139 μm may be achieved by creating a groove with a bottom surface roughness of 3.170 μm.