Preface

The International Conference on Next-Generation Electronics & Photonics (INGEP 2024) was held with resounding success in Hangzhou, China, from April 11th to 14th, 2024. This prestigious event brought together over 380 esteemed participants from around the globe. The conference featured 9 plenary speeches, 89 invited talks, 125 oral presentations by prominent scholars and scientists, and 98 poster exhibitions. The conference explored a broad spectrum of advanced topics, including: 1. Advanced electronic devices, memory devices, electronic systems 2. Low-dimension materials, devices, and technologies 3. Wide band gap semiconductor materials, devices, and technologies 4. Flexible and wearable electronics 5. Optoelectronic devices and systems, advanced display technologies 6. Nanophotonics 7. Integrated quantum photonics 8. Photovoltaic materials and technologies 9. Advanced sensors, actuators, MEMS 10. BioMEMS, biomedical devices, microfluidics 11. Energy harvesting technologies 12. Wireless sensing technologies INGEP 2024 provided a premier platform for experts, scholars, and researchers to present the latest breakthroughs and exchange innovative ideas in the realms of next-generation electronics and photonics. The conference was a remarkable success and served as a beacon of inspiration. The event was organized by Zhejiang University (China) and co-organized by the University of Cambridge (UK), RMIT University (Australia), Northumbria University (UK), University of Surrey (UK), Jinhua Institute of Zhejiang University, and Shaoxing Institute of Zhejiang University (China). It garnered support from the Institute of Physics (IOP), American Institute of Physics (AIP), and MDPI publishers, with sponsorship from 15 distinguished companies and publishers. List of Honorary chairs of the conference and The technical program committee and reviewers of the conference are available in this Pdf.