Calculation of Cable SGEMP Response for PCB Trace Based on Finite Element Method

When a printed circuit board (PCB) is irradiated by transient X-ray, photoelectrons will be emitted due to the photoelectric effect, resulting in coupling current response on the metal trace, which may interfere with or damage the components connected to the trace. This article derives the transmission line equation of PCB trace under X-ray irradiation and establishes a simulation code based on the finite element method (FEM), which can more accurately express the distribution of deposited charges in the substrate, making the simulation results more accurate. The effects of some parameters (such as trace width, substrate thickness, and bias voltage) on the coupling response were simulated and analyzed.