A DC-43.5 GHz Wire-Bonding and Vertical Via Interconnection by Embedded Nonuniform Elliptical Technique for 3-D System in Package

In this article, a novel ultrawide wire-bonding and vertical via interconnection are proposed for 3-D system in package (SiP) by embedded nonuniform elliptic technique. The vertical compensation structure of the bonding wires is constructed by an elliptic capacitive stripline with a series inductance short via. For vertical via interconnection, the elliptical slot is employed to act as a seventh-order low-pass filter with the quasi-coaxial structure, which is formed by the signal hole surrounded by several grounded holes. The impedance fluctuation is significantly reduced by gradually changing the width of the elliptic structure. The coupling between the adjacent wires is added to build the equivalent circuit model, which can accurately analyze the transmission behavior of the wire-bonding interconnection. From the measurement results, the return loss is better than 15 dB and the insertion loss is less than 1 dB within the frequency range of dc-43.5 GHz.