All-Regions Damage Extraction Method for SiC IGBTs Based on <i>C-V</i> Curves

SiC IGBTs take the advantages of high breakdown voltage and high conduction current, being a new type of power device with great application prospects in power transmission fields. However, foreseeable stress conditions such as gate stress, irradiation, and bipolar conduction may cause damage to the gate oxide and the epitaxial layer of SiC IGBTs, leading to degradation. Analysis of the device capacitance components shows that the damages in the gate oxide and the epitaxial layer results in variations in the gate capacitance and the substrate junction capacitance before and after enduring a stress. Therefore, the all-regions damage extraction method for SiC IGBT based on C-V curves is proposed for the first time. This method divides the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${C}_{\text {G}}$ </tex-math></inline-formula>-<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {G}}$ </tex-math></inline-formula> curve of SiC IGBT into six parts, whose shifts can reflect the damages in the gate oxide damage and epitaxial layer, respectively. Furthermore, the polarity and the degree of the damages can be extracted based on the direction and magnitude of the drift in the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${C}_{\text {G}}$ </tex-math></inline-formula>-<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {G}}$ </tex-math></inline-formula> curve. Moreover, by analyzing the drift in the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${C}_{\text {GC}}$ </tex-math></inline-formula>-<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {CE}}$ </tex-math></inline-formula> and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\text {1/}{C}_{\text {GC}}^{{2}}$ </tex-math></inline-formula>-<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {CE}}$ </tex-math></inline-formula> curves before and after stress, the more accurate extraction of the density and localization of defect introduced in epitaxial layer can be achieved.

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Publication Details

Journal
IEEE Transactions on Device and Materials Reliability
Published
2024-08-13
DOI
https://doi.org/10.1109/tdmr.2024.3443107
Citations
1
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.21

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article

All-Regions Damage Extraction Method for SiC IGBTs Based on C-V Curves

Zhaoxu Song, Junhou Cao, Zhaoxiang Wei, Jiaxing Wei et al.
1 citations
IEEE Transactions on Device and Materials Reliability
Silicon Carbide Semiconductor Technologies
0.21
article

All-Regions Damage Extraction Method for SiC IGBTs Based on C-V Curves

Zhaoxu Song, Junhou Cao, Zhaoxiang Wei, Jiaxing Wei, Hao Fu, Tuanzhuang Wu, Shaohong Li, Chenlu Wang, Lei Huang, Siyang Liu, Weifeng Sun
article en
1 citations

Abstract

SiC IGBTs take the advantages of high breakdown voltage and high conduction current, being a new type of power device with great application prospects in power transmission fields. However, foreseeable stress conditions such as gate stress, irradiation, and bipolar conduction may cause damage to the gate oxide and the epitaxial layer of SiC IGBTs, leading to degradation. Analysis of the device capacitance components shows that the damages in the gate oxide and the epitaxial layer results in variations in the gate capacitance and the substrate junction capacitance before and after enduring a stress. Therefore, the all-regions damage extraction method for SiC IGBT based on C-V curves is proposed for the first time. This method divides the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${C}_{\text {G}}$ </tex-math></inline-formula>-<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {G}}$ </tex-math></inline-formula> curve of SiC IGBT into six parts, whose shifts can reflect the damages in the gate oxide damage and epitaxial layer, respectively. Furthermore, the polarity and the degree of the damages can be extracted based on the direction and magnitude of the drift in the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${C}_{\text {G}}$ </tex-math></inline-formula>-<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {G}}$ </tex-math></inline-formula> curve. Moreover, by analyzing the drift in the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${C}_{\text {GC}}$ </tex-math></inline-formula>-<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {CE}}$ </tex-math></inline-formula> and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\text {1/}{C}_{\text {GC}}^{{2}}$ </tex-math></inline-formula>-<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {CE}}$ </tex-math></inline-formula> curves before and after stress, the more accurate extraction of the density and localization of defect introduced in epitaxial layer can be achieved.

IEEE Transactions on Device and Materials ReliabilityVol. 24(4)
Southeast University (CN)
National Natural Science Foundation of China
Openalex Percentile: Top 49%
Silicon Carbide Semiconductor Technologies
0.21
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