A Co-Planarized Common Cathode Micro-LED Display That Is Produced Using Planarization and a Copper Process

This study uses advanced 3D packaging planarization and a copper process to manufacture a co-planarized common cathode Micro-LED display. The experimental results show that SiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> and copper electrodes are at the same height and lie in a horizontal line after a chemical mechanical polishing (CMP) process. Compared with a conventional Micro-LED display structure, the copper electrode has a lower starting voltage of 2.72V. In addition, when the electrodes were operated for 19 mA, the temperature of the copper electrode structured Micro-LED also is <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2.2~^{\circ }$ </tex-math></inline-formula>C cooler. Therefore, the self-heating effect that is inherent in light-emitting diodes (LEDs) is mitigated by the superior thermal conductivity of copper.