A novel low-resistance solder-free copper bonding joint using a warm pressure welding method for REBCO coated conductors

Abstract Constrained by the fabrication of second-generation high-temperature superconducting (2G HTS) tapes, connecting multiple pieces of tapes through joints is often necessary in large-scale applications. In the application of HTS magnets, joint technology is key for achieving closed-loop operation and reducing thermal loads. However, most soldered joints still cannot achieve the expected results. Thus, there is an urgent need to find a method for easily fabricating low-resistance joints. In this study, a low-resistance solder-free copper bonding joint for 2G HTS copper-plated tapes is proposed. The formation mechanism of the joint is presented, and the effects of the bonding temperature and pressure on the electrical and mechanical properties of the copper bonding joint are investigated. The results show that the copper bonding joint can be manufactured by pretreating the tape for 5 min and bonding it in the air for 3 min at 333 MPa at temperatures higher than (or equal to) 150 °C or at pressures greater than (or equal to) 250 MPa and 180 °C. The characteristic resistance of this joint is approximately 16.8 nΩ cm 2 , which is approximately one-third lower than that of soldered joints, and it has mechanical properties similar to those of soldered joints under axial tension. We believe that the application of this type of copper bonding joint can significantly aid in the design and manufacturing of large HTS magnets.