Interference Lithography‐Based Fabrication of 3D Metallic Mesostructures on Reflective Substrates using Electrodeposition‐Compatible Anti‐Reflection Coatings for Power Electronics Cooling (Adv. Electron. Mater. 8/2024)
Fabrication of 3D Metallic Mesostructures In article number 2300827, Paul V. Braun and co-workers discover the transformative power of nanostructured copper oxide (nCO) coatings in enhancing cooling efficiency. Electrochemically reducible, the nCO coatings enable intricate interference lithography process on reflective semiconductor substrates, fostering electrodeposition of mesostructured metals. These mesostructured coatings provide 3× heat flux and 2× heat transfer coefficient improvements over conventional systems, with a particular impact on power electronics cooling. [Image created by Gaurav Singhal and Alex Jerez Roman.]
Authors
- Gwangmin Bae
- Seokwoo Jeon (ORCID: https://orcid.org/0000-0002-5338-0671)
- Nenad Miljkovic (ORCID: https://orcid.org/0000-0002-0866-3680)
- Paul V. Braun (ORCID: https://orcid.org/0000-0003-4079-8160)
- Kai‐Wei Lan (ORCID: https://orcid.org/0009-0008-8310-6295)
- Youngjin Ham (ORCID: https://orcid.org/0000-0002-0587-9099)
- Shailesh Narayan Joshi (ORCID: https://orcid.org/0000-0001-7218-1187)
- Gaurav Singhal (ORCID: https://orcid.org/0000-0001-5355-7978)
- Sujan Dewanjee (ORCID: https://orcid.org/0000-0002-4474-5157)
- Danny J. Lohan (ORCID: https://orcid.org/0000-0002-0931-700X)
- Tarek Gebrael (ORCID: https://orcid.org/0000-0002-7543-0887)
- Jiaqi Li (ORCID: https://orcid.org/0000-0002-3218-5930)
Institutions
- Kyushu University (JP)
- University of Illinois Urbana-Champaign (US)
- Korea University (KR)
- University of Cambridge (GB)
- Toyota Research Institute
Publication Details
- Journal
- Advanced Electronic Materials
- Published
- 2024-08-01
- DOI
- https://doi.org/10.1002/aelm.202470028
- Primary Topic
- Nanomaterials and Printing Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00