Effect of multiple conductions on basic parameters in linear and saturation regions for a MIS-HEMT from 450 K down to 200 K

In this work, the effect of multiple conductions on the basic parameters in linear and saturation regions of a GaN based Metal-Insulator-Semiconductor High Electron Mobility Transistor (MIS-HEMT), when operating in a temperature range from 450 K down to 200 K, is evaluated experimentally. The threshold voltage behavior suggests that the HEMT conduction is dominating the device for low temperatures, while the MOS conduction is the dominant one for high temperatures. It is also shown that the presence of a high gate leakage current is degrading the switching efficiency and the ION/IOFF ratio of the device. The device presents a minimum Drain Induced Barrier Lowering (DIBL) of 27 mV/V (at 300 K) and the maximum of 62 mV/V (at 450 K).

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Publication Details

Journal
Journal of Integrated Circuits and Systems
Published
2024-08-01
DOI
https://doi.org/10.29292/jics.v19i2.812
Citations
1
Primary Topic
Magnetic Properties and Applications
Type
article
Field-Weighted Citation Impact
0.12

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article

Effect of multiple conductions on basic parameters in linear and saturation regions for a MIS-HEMT from 450 K down to 200 K

Welder F. Perina, Paula Ghedini Der Agopian, Eddy Simoen, Nadine Collaert et al.
1 citations
Journal of Integrated Circuits and Systems
Magnetic Properties and Applications
0.12
article

Effect of multiple conductions on basic parameters in linear and saturation regions for a MIS-HEMT from 450 K down to 200 K

Welder F. Perina, Paula Ghedini Der Agopian, Eddy Simoen, Nadine Collaert, João Antônio Martino, Uthayasankaran Peralagu
article en
1 citations

Abstract

In this work, the effect of multiple conductions on the basic parameters in linear and saturation regions of a GaN based Metal-Insulator-Semiconductor High Electron Mobility Transistor (MIS-HEMT), when operating in a temperature range from 450 K down to 200 K, is evaluated experimentally. The threshold voltage behavior suggests that the HEMT conduction is dominating the device for low temperatures, while the MOS conduction is the dominant one for high temperatures. It is also shown that the presence of a high gate leakage current is degrading the switching efficiency and the ION/IOFF ratio of the device. The device presents a minimum Drain Induced Barrier Lowering (DIBL) of 27 mV/V (at 300 K) and the maximum of 62 mV/V (at 450 K).

Journal of Integrated Circuits and SystemsVol. 19(2)
Fundação de Apoio à Universidade Federal de São Paulo (BR), IMEC (BE), Universidade Estadual Paulista (Unesp) (BR)
Fundação de Amparo à Pesquisa do Estado de São Paulo, Coordenação de Aperfeiçoamento de Pessoal de Nível Superior, Conselho Nacional de Desenvolvimento Científico e Tecnológico
Affordable and clean energy
Openalex Percentile: Top 68%
Magnetic Properties and Applications
0.12
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Effect of multiple conductions on basic parameters in linear and saturation regions for a MIS-HEMT from 450 K down to 200 K — Welder F. Perina, Paula Ghedini Der Agopian, et al. · Journal of Integrated Circuits and Systems (2024) | TGRS Research Map | TGRS