Study of Fluid Flow and Heat Transfer in Microchannel Heat Sinks for Electronics Cooling Application

Abstract: Today’s age of rapid technological advancements has led to a significant rise in the demand for high-performance electronic chips with high power density. Effective thermal management of such high-power density systems is crucial for their performance, life and reliability. Growing trends of miniaturization and densely packed circuits have necessitated the development of optimized cooling methods, particularly for high-density electronic chips and flexible microelectronic devices. Amongst the presently available cooling techniques such as passive air cooling, forced air cooling, microchannel heat sink, liquid cold plates cooling and heat pipe, the microchannel heat sink technique stands out from the rest owing to its high rate of heat dissipation due to larger surface area to volume ratio. Current work explored three new enhancements in micro channel heat sink (MCHS) for electronic cooling. The new design have different geometry and different enhancement techniques compared with respect to the enhancement over their respective conventional domain. Three dimensional computational models based on finite volume approach were created incorporating the enhancement techniques and analysed numerically in ANSYS Workbench.