Navigating the frontier: Additive Manufacturing’s role in synthesizing piezoelectric materials for flexible electronics

Additive manufacturing (AM) has significantly transformed the fabrication of functional materials, particularly in electronics and biomedical engineering. This study reviews stereolithography (SLA), selective laser sintering (SLS), fused deposition modeling (FDM), direct ink writing (DIW), and inkjet printing for flexible electronic applications. The review highlights SLA-based 3D printing’s better ability to optimize material compositions, printing procedures, and post-processing methods to improve material characteristics. Photosensitive materials and shrinkage-induced internal tensions seems to be its major constraint. Additionally, SLS 3D printing has improved composite materials' electrical, mechanical, and thermal properties. It has drawbacks including permeable structures and internal tensions. In FDM 3D printing, mechanical and electrical qualities are improved for piezoelectric sensor manufacture. Warping and nozzle blockage require additional study. DIW’s versatility in constructing complicated structures with increased features for energy harvesting and sensor development is also mentioned. We identify ink development and printer nozzle clogging issues. The review concludes that inkjet printing can provide a variety of materials for flexible electronics. Since it integrates the latest discoveries with technological developments, this study may help guide future research and promote innovation in the sector. Overall, additive manufacturing methods provide a new era of sensor technology by offering unrivalled flexibility and versatility.