Wafer-bonded In0.53Ga0.47As/GaN p–n diodes with near-unity ideality factor

III–V/III-nitride p–n junctions were realized via crystal heterogeneous integration, and the resulting diodes were characterized to analyze electrical behavior and junction quality. p-type In0.53Ga0.47As, which is a well-established base layer in InP heterojunction bipolar transistor (HBT) technology, was used in combination with a homoepitaxial n-type GaN. The latter offers low dislocation density, coupled with high critical electric field and saturation velocity, which are attractive for use in future HBT collector layers. Transmission electron microscopy confirms an abrupt interface in the fabricated heterogeneous diodes. Electrical characterization of the diodes reveals a near-unity ideality factor (n ∼ 1.07) up to 145 °C, a high rectification ratio of ∼108, and a low interface trap density of 3.7 × 1012 cm−2.

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Publication Details

Journal
Applied Physics Letters
Published
2024-08-05
DOI
https://doi.org/10.1063/5.0194526
Citations
5
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
1.55

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article

Wafer-bonded In0.53Ga0.47As/GaN p–n diodes with near-unity ideality factor

Bing-Ruey Wu, Spyridon Pavlidis, Seiji Mita, Shane Stein et al.
5 citations
Applied Physics Letters
GaN-based semiconductor devices and materials
1.55
article

Wafer-bonded In0.53Ga0.47As/GaN p–n diodes with near-unity ideality factor

Bing-Ruey Wu, Spyridon Pavlidis, Seiji Mita, Shane Stein, B. D. Little, Zlatko Sitar, Keith Markham, Fred Kish, Rohan Sengupta, J. Houston Dycus
article en
5 citations

Abstract

III–V/III-nitride p–n junctions were realized via crystal heterogeneous integration, and the resulting diodes were characterized to analyze electrical behavior and junction quality. p-type In0.53Ga0.47As, which is a well-established base layer in InP heterojunction bipolar transistor (HBT) technology, was used in combination with a homoepitaxial n-type GaN. The latter offers low dislocation density, coupled with high critical electric field and saturation velocity, which are attractive for use in future HBT collector layers. Transmission electron microscopy confirms an abrupt interface in the fabricated heterogeneous diodes. Electrical characterization of the diodes reveals a near-unity ideality factor (n ∼ 1.07) up to 145 °C, a high rectification ratio of ∼108, and a low interface trap density of 3.7 × 1012 cm−2.

Applied Physics LettersVol. 125(6)
North Carolina State University (US), Keysight Technologies (United States) (US), Eurofins (United States) (US), Adroit Materials (United States) (US)
National Science Foundation
Affordable and clean energy
Openalex Percentile: Top 18%
GaN-based semiconductor devices and materials
1.55
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Wafer-bonded In0.53Ga0.47As/GaN p–n diodes with near-unity ideality factor — Bing-Ruey Wu, Spyridon Pavlidis, et al. · Applied Physics Letters (2024) | TGRS Research Map | TGRS