The effect of phosphorous content on the microstructure and localised corrosion of electroless nickel-coated copper

A detailed microstructural and electrochemical analysis of electroless nickel phosphorous (NiP) coatings with P contents of 13.2 ± 1.2 wt%, 12.9 ± 0.7 wt%, and 8.3 ± 0.8 wt% on a copper substrate was performed to study the corrosion behaviour of electroless NiP/Cu systems. The P content of the electroless NiP coatings plays an essential role in the microstructure of the coatings in terms of crystallinity. The crystallinity variations, representing the extent of crystalline and amorphous phases within the material, with P content, affect the local electrochemical characteristics and, hence, the corrosion protection behaviour of electroless NiP coatings. The coatings with the highest P content showed the best corrosion performance in a 3.5 wt-% NaCl solution. In contrast, the surface of the electroless NiP coatings with low P content is more susceptible to corrosion due to the presence of locations with heterogeneous electronic properties that initiate localised corrosion. Microgalvanic interactions with a high cathode-to-anode surface ratio govern the localised corrosion kinetics of the low P-content samples. A high concentration of nodule boundaries and/or other existing structural defects on the surface serve as anodic sites, whereas the remainder of the surface serves as cathodic sites.