Analysis and optimization of solder joint stress of bus bar under random vibration and temperature cycle

Aiming at the solder joint cracking phenomenon of bus bar, a radar plane power supply was taken as the research object. The finite element model of solder joint of bus bar was established, and the stress simulation analysis of solder joint stress of bus bar under random vibration and temperature cycle was respectively carried out. The results show that compared with random vibration, temperature change has significant effect on solder joint stress. The influence of structure parameters of solder joint on stress under random vibration and temperature cycle was analyzed. The results show that in the temperature cycle process, the maximum stress of solder joint decreases by 3.5MPa after optimization. It is verified by physical test that increasing solder joint diameter or height can reduce the solder joint stress of bus bar under temperature cycle.