Blind interconnection design method based on subminiature push-on coaxial connector

During the use of traditional connectors, it is not only necessary to reserve the installation space of the connector itself, but also to consider the assembly operation space and cable routing space of the connector, which greatly affects the efficiency of space utilization within the system, reduces the integration of the system, and increases the weight of the system. With the continuous growth of connector demand and the update of new technologies and materials, the technological development in the connector field is very rapid. In the field of RF connectors, a new type of RF connector-Subminiature Push-On (SMP) emerged, which could be used for high-density blind insertion between printed boards, chassis, cabinets, and other places. In order to promote the application of SMP, the basic physical characteristics of SMP series coaxial connectors had been analyzed. Then, blind interconnecting design method for SMP applications were proposed, which specified the principle & process of blind interconnecting, and the requirements for blind interconnecting structure and methods of tolerance calculation. In addition, the analysis showed that the key structural parameters of blind interconnecting were axial misalignment and radial misalignment. A serial of experimental research work had been carried out to explore the effects of the two parameters on the RF link performance parameters including VSWR, insertion loss, and phase,. It was found that axial misalignment is the more crucial parameter that need to be control in design, because radial misalignment ≤ 0.4mm has minimal impact on phase, standing wave and insertion loss, while axial misalignment has a particularly significant impact on these parameters. Based on this study, it can provide a more scientific method guidance and data support for the related detailed design of cable-less.