Effect of thiol adsorption on the electrical resistance of copper ultrathin films

• Thin copper films (20 nm) were deposited via thermal evaporation , with variations in substrate temperature (T s = RT, 330 K, and 390 K). • Films deposited at 330 K exhibited the smallest percolation thickness (12 nm) and aging rates due to their compact morphology, showcasing lower surface roughness (δ) and correlation length (ξ). • Immersion of the films in a dodecanethiol solution (1 mM) in ethanol resulted in significant resistance increment, ranging from 0.1 % to 0.4 %. • By depositing a chromium surfactant layer, the impact of the electron-surface scattering mechanism on resistivity was amplified, leading to a resistance increase of up to 1.2% due to thiols adsorption. • The negatively charged S-head of the adsorbed thiols on the copper oxide surface, altering the charge balance below the Cu 2 O/Cu interface, enhancing the electrical resistance. The impact of thiol adsorption on thin copper films, covered with a copper oxide layer, was investigated using electrical resistance measurements at various stages: during film growth, aging, exposure to air, and immersion in thiol solutions. Thin copper films (20 nm) were thermally evaporated, with variations in substrate temperature (RT, 330 and 390 K). Films deposited at 330 K exhibited the smallest percolation thickness and aging rates due to their compact morphology, showcasing lower surface roughness and correlation length. Exposure to air led to the formation of a Cu 2 O layer on the film surface. Subsequent immersion in a dodecanethiol solution in ethanol resulted in a resistance increase, ranging from 0.1 % to 0.4 %. This change was dependent on the substrate temperature, with the largest difference observed at 330 K. This observation suggests that samples grown at this temperature exhibited the highest electron-surface scattering. Moreover, by depositing a chromium surfactant layer, the impact of this scattering mechanism was amplified, leading to a resistance increase of up to 1.2 %. Mayadas-Shatzkes theory provided a good description of these resistance changes. The negatively charged S-head of the adsorbed thiols alters the electric field experienced by conduction electrons in the Cu 2 O/Cu interface, modifying the electron-surface scattering.

Authors

Institutions

Publication Details

Journal
Applied Surface Science
Published
2024-08-05
DOI
https://doi.org/10.1016/j.apsusc.2024.160912
Primary Topic
Copper Interconnects and Reliability
Type
article
Field-Weighted Citation Impact
0.00

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Effect of thiol adsorption on the electrical resistance of copper ultrathin films

Ricardo Henríquez, Patricio Häberle, Francisca Marín, Jonathan Correa‐Puerta et al.
Applied Surface Science
Copper Interconnects and Reliability
article

Effect of thiol adsorption on the electrical resistance of copper ultrathin films

Ricardo Henríquez, Patricio Häberle, Francisca Marín, Jonathan Correa‐Puerta, Valeria del Campo, Gabriel Gray, Rodrigo Segura, Marcos I. Flores, Claudio González‐Fuentes
article en

Abstract

• Thin copper films (20 nm) were deposited via thermal evaporation , with variations in substrate temperature (T s = RT, 330 K, and 390 K). • Films deposited at 330 K exhibited the smallest percolation thickness (12 nm) and aging rates due to their compact morphology, showcasing lower surface roughness (δ) and correlation length (ξ). • Immersion of the films in a dodecanethiol solution (1 mM) in ethanol resulted in significant resistance increment, ranging from 0.1 % to 0.4 %. • By depositing a chromium surfactant layer, the impact of the electron-surface scattering mechanism on resistivity was amplified, leading to a resistance increase of up to 1.2% due to thiols adsorption. • The negatively charged S-head of the adsorbed thiols on the copper oxide surface, altering the charge balance below the Cu 2 O/Cu interface, enhancing the electrical resistance. The impact of thiol adsorption on thin copper films, covered with a copper oxide layer, was investigated using electrical resistance measurements at various stages: during film growth, aging, exposure to air, and immersion in thiol solutions. Thin copper films (20 nm) were thermally evaporated, with variations in substrate temperature (RT, 330 and 390 K). Films deposited at 330 K exhibited the smallest percolation thickness and aging rates due to their compact morphology, showcasing lower surface roughness and correlation length. Exposure to air led to the formation of a Cu 2 O layer on the film surface. Subsequent immersion in a dodecanethiol solution in ethanol resulted in a resistance increase, ranging from 0.1 % to 0.4 %. This change was dependent on the substrate temperature, with the largest difference observed at 330 K. This observation suggests that samples grown at this temperature exhibited the highest electron-surface scattering. Moreover, by depositing a chromium surfactant layer, the impact of this scattering mechanism was amplified, leading to a resistance increase of up to 1.2 %. Mayadas-Shatzkes theory provided a good description of these resistance changes. The negatively charged S-head of the adsorbed thiols alters the electric field experienced by conduction electrons in the Cu 2 O/Cu interface, modifying the electron-surface scattering.

Applied Surface ScienceVol. 673
Valparaiso University (US), Pontificia Universidad Católica de Chile (CL), Helmholtz-Zentrum Dresden-Rossendorf (DE), Forschungsverbund Berlin (DE), Millenium Nucleus for Planet Formation (CL), University of Chile (CL), Federico Santa María Technical University (CL)
Agencia Nacional de Investigación y Desarrollo
Clean water and sanitation
Openalex Percentile: Top 93%
Copper Interconnects and Reliability
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.